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SMTA International 2025（SMTAi）将于美国时间10月19日至23日在美国伊利诺伊州罗斯蒙特举办“国际电子制造与SMT技术封装大会”。铟泰公司中国区技术经理胡彦杰和铟泰公司研发部助理经理白进进将代表铟泰中国出席本次大会，并发表两场重要技术演讲。分享我们在系统级封装与焊接技术方面的最新研究成果。

PRESENTATION DETAILS

演讲主题：

Application of New Ultra-Low Residue Solder Paste for System-in-Package

演讲时间：

Wednesday October 22, 2025 2:30pm – 3:00pm CDT

演讲摘要：
In the context of system-in-package (SiP) assembly, solder paste printing is widely regarded as the preferred method of solder application. Given the necessity for compatibility with subsequent underfill and molding processes, the predominant selection involves water-soluble solder paste in conjunction with a flux-cleaning operation. To streamline the assembly process and minimize costs, the adoption of ultra-low residue (ULR) solder paste, in combination with ULR flip-chip flux, presents a viable alternative. This thesis presents the development and application of a novel solder paste, designated as F-1, which comprises of flux F-1 combined with Sn96.5Ag3.0Cu0.5 (SAC305) Type 6 (T6) fine solder powder. The primary advantage of utilizing this solder paste lies in its generation of minimal and entirelybenign flux residues, which are anticipated to be compatible with molding underfill (MUF) or capillary underfill (CUF) materials, thereby obviating the need for a flux cleaning process during packaging. Furthermore, assessments of solderability, slump behavior, and printing performance provide compelling evidence that solder paste F-1 is a suitable material for high-density SiP assembly processes.

INDUSTRY EXPERT

胡彦杰

资深技术专家，铟泰公司中国区技术经理，深耕半导体封装领域20年，专注于先进封装技术开发与工艺优化，对电子组装及封装材料应用有着深刻的理解和丰富的实践经验。曾为众多行业头部客户提供技术支持，助力技术升级，并积累大量成功案例。

现任铟泰公司中国区技术负责人，统筹全国技术团队为半导体封装及电子制造客户提供全流程技术和产品支持。曾在CSTIC、IMAPS、CSPT、PCIM、SMTA等国内外论坛以及学术会议上发表多篇技术文章，担任中国SMTA技术顾问委员会委员、审稿人。拥有中科院计算技术研究所集成电路工程硕士及南开大学理学学士学位。

PRESENTATION DETAILS

演讲主题：

A Novel Flux-Less Solder Paste Reflowed Under Formic Acid for Surface Mounting Technology

演讲时间：

Wednesday October 22, 2025 2:00pm-2:30pm CDT

演讲摘要：
Solder paste is utilized as the main soldering material in the applications of Surface mounting technology (SMT). Approximately 50% flux by volume in the traditional solder paste leads to more or less post reflow flux residues which has risks of electro migration and conformal coating compatibility directly impact the potential for early device failures. Flux-less soldering which means residue free soldering with gaseous activation such as formic acid has been investigated for decades, most studies are well established in the field of preform or solder bump soldering. And flux-less solder paste is being evaluated by semiconductor markets. This passage explored the potential for the flux-less solder paste in SMT application. A novel flux less solder paste with Sn96.5Ag3.0Cu0.5 (SAC305) and a specially-designed binder was developed and tested according SMT process. The performance testing included printability, wetting, voids, residue content, SIR. These tests were conducted and compared with regular no-clean solder paste for SMT application.

INDUSTRY EXPERT

白进进

白进进，铟泰公司研发部助理经理，专注于先进半导体和电子组装材料的开发及应用。

她在半导体和电子组装先进材料方面拥有十余年的开发经验。主导开发了在减少锡珠方面性能优异的新型焊锡膏材料；并打破细粉焊锡膏如五号粉必须在氮气气氛下回流的瓶颈，成功研制了可以应用于空气回流的五号粉焊锡膏。目前，她正致力于半导体芯片粘接新材料的开发。

产品推荐

在传统的焊接工艺中，传统锡膏依靠助焊剂来清除焊接层界面的氧化物，以确保焊料的润湿性。在大多数情况下，尤其是在功率电子封装中，回流后的残留物必须进行清洗以确保器件可靠性。甲酸作为一种高效环保的无助焊剂替代方案，在回流焊接过程中展现优异的工艺特性。我们的FAST锡膏为此而设计，助焊剂被一种由溶剂和触变剂组成的复合物所取代，不仅提供了优异的操作性能，同时消除了回流后清洗的步骤。

FAST锡膏技术优势：

无需清洗：FAST锡膏中的创新复合粘结剂在回流过程中完全蒸发，几乎不留任何残留物，且无需清洗。

简化流程：省去回流后的清洗步骤意味降本增效；工艺步骤的减少，也意味着降低了工艺风险。

兼容性：采用FAST锡膏焊接的元件表面干净无残留；可直接进行引线键合、封装或灌封等后续工序。

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随着电子产品的不断升级和新应用的涌现，电子制造技术正面临着前所未有的挑战和机遇。铟泰公司通过持续的技术创新，为行业发展注入新的动力，助力客户在激烈的市场竞争中保持领先地位。

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